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TMP117: Can the sensor package be exposed to a liquid?

Part Number: TMP117

Hello,

Is the TMP117 package hermetically sealed, where the outer package area can potentially be exposed to a liquid (i.e. DI water) without damaging the device? Please attached image for a side view cross section of example.

Does TI have any application recommendations any of their digital temperature sensors to liquids?

Thanks!

  • Hi Alan,

    Yes, the package can be exposed to liquid.  We have done testing in DI water, oil bath.  The main concern is contamination on the device leads.  I recommend using a water soluble flux and water wash on the manufacturing of the boards.  Using a standard flux and chemical wash can leave contaminants which become troublesome when exposed to water or other liquids.  From your image, it looks like you would have the leads protected with epoxy, so the liquid would never come in contact with the potential contaminants.  This should work well for your application.  In our testing, we did not have any protection on the leads, therefore removing all potential contaminants was especially important.  

  • Great! Follow up question...

    Since in our application (same picture) heat conduction will be through the top of the package, do you recommend to remove the thermal pad from the device footprint (to minimize thermal losses)?

    Thanks!

  • Yes, in general, this is recommended.

  • Great, thank you for your help!