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TMAG6180-6181EVM: sensor position within housing

Michael Müller
Prodigy 20 points
Part Number: TMAG6180-6181EVM

Hello,

I have some questions regarding the mecahnical drawing in the datasheet and the shown /specified position of the sensor within the housing.

It is not clear whether the tolerance value “centered +-25µm” is the alignment of only the AMR sensor, only the Hall sensor, or both in regard to the package center. Which of these cases is correct?

What is the positional tolerance of the ARM sensor to the Hall sensor?

The alignment tolerance on the x-axis is not specified. Could you provide this value?

Further the horizontal arrow does not reach to the middle of the ARM / Hall sensor, but ends at the hall sensor (encircled in green). Without the knowledge of the width of the Hall sensor this value has no purpose. Is this intended? Shouldn't the arrow end in the middle of the sensors?

Are the ARM sensor and Hall sensor technically aligned to the housing or to the device pins?

Best regards

  • 0
    TI__Genius 16620 points

    Michael,

    Thank you for reaching out on E2E with your questions.

    • The AMR and Hall sensing elements are both on the same die.  The primary cause for this tolerance is related to package assembly tolerances, and so this should apply to both sensors simultaneously.  
    • The +/- 25 um tolerance should relate to how well centered the die is in both X and Y directions.
    • The package is 3mm x 3mm, so any additional width related to the width of the Hall element is not possible.  This arrow must be intending to represent the distance to center of the Hall element, and it would be a more accurate representation to draw the arrow all the way to the center.  I will pass this along to the editor of the document. I would expect it was drawn this way to avoid overlapping the other text markings.  Sorry for the confusion here.
    • The manufacturing process would mount the die to the lead frame prior to applying the mold compound.  Several units would typically reside on a single frame during this process.  After the compound step is finished the devices would be cut from the frame to singulate the units.  However, in our datasheets this alignment tolerance is typically given with respect to the mold compound itself.

    Thanks,

    Scott