This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

HDC3022: HDC3022 Design Question

Part Number: HDC3022

Team,

I want to check with you about 2 design questions for my customer:

1. HDC3022's power sequencing: When the I2C is powered on first and then HDC3022 powered on, is there application risk?

2. Alert pin default voltage status when device power on. And is there spec of the rising edge and falling edge slope?

Thanks!

Regards,

Qiang

  • Qiang,

    Thanks for reaching out. Let me answer your questions one at a time.

    1. There should not be an issue if the I2C lines are powered on before the VDD, there should not be an ESD risk here.

    2. The ALERT pin is a push-pull output, and by default should be LOW. I do not have a spec or graph of the rising and falling edges of the ALERT outputs.

    Thanks

    -Alex Thompson

  • Alex,

    And for the thermal PAD, can we leave it floating when testing the environment temperature? Does it influence the HDC3022 thermal operation condition without thermal pad connected to GND?

    Regards,

    Qiang

  • Qiang, 

    That's a great question, and it depends on what the customer wants to do. It is general best practice to solder the thermal pad and connect it GND (not connected to GND internally) and this will work well for most applications. However to maximize heater temp rise (efficiency) and sense the ambient temp more effectively, they should not solder the thermal pad.

    Based on your statement "testing the environment temperature", I think it would be fine if you left it floating and unsoldered. I have not observed any meaningful difference in ambient temperature accuracy if the thermal pad is soldered or not.

    Regards

    -Alex Thompson