DRV5013-Q1: Whether this material supporting Reflow Soldering

Fabio,

The success of using a though-hole package with a solder reflow profile depends on the capabilities of the assembly house.  Typically to accomplish this you would likely need to use minimum size holes for the leads to limit gaps where the reflow might fail.  

One particular concern, however, is the final alignment of the sensor.  Since the actual sensor position might vary and affect the accuracy of the system, it might be necessary to use a spacer or stand-off of some kind to keep the component aligned correctly during the reflow process.  

If this package option is in use because a horizontal field component is needed, we do also have TMAG5123 (switch) or TMAG5110 (latch) which are able to detect horizontal fields in a surface mount package.

Thanks,

Scott