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HDC1080: Guidelines for Copper Area and Via Usage under Floating DAP in Sensor Layout

Edel Díaz
Prodigy 10 points
Part Number: HDC1080

Tool/software:

Hi,

I have a question regarding the soldering area that should be left beneath the sensor connected to the DAP pin.
According to the datasheet: "Die Attach Pad. Should be left floating - The DAP may be soldered to a floating pad on the board, but the board pad should NOT be connected to GND."

In the layout example, it shows that 6 vias are placed in that area. My question is whether these vias are necessary?, and in the case of a multilayer PCB, should this copper area be replicated on all layers to increase the total copper area? My PCB has 12 layers.

Thanks