NEED INFORMATION- LM94022BIMGX

Hi Jayakumara,

I would like to inform you that I am currently working on this, and get back to you soon.

Aaron

Hi Jayakumara,

I’m sorry for such a delay. Here is the information that you requested, but I was unable to find the information for (qJB) and (qJC). I need to submit the request; however, this may be a long process.

1.       Junction temperature max (TJmax)

• ·         150°C

2.       Typical power dissipation (Pd typ)

• ·         Let assume that you are using Vs = 3.5V
• ·         The typical current in the datasheet is 5.4uA
• ·         To calculate the typical power that the die is allowed to dissipate Q = Vs * Ips = 3.3 * 5.4uA = 18.9uW

3.       Maximum power dissipation (Pd max) assuming there are no load and it only includes the supply current in the calculation.

• ·         Let assume that you are using Vs(max) = 5.5V
• ·         The maximum current in the datasheet is 9uA
• ·         To calculate the typical power that the die is allowed to dissipate Q = Vs(max) * Ips = 5.5 * 9uA = 49.5uW

4.       Thermal resistance junction to ambient (theta JA)

• ·         415°C/W

7.       Weight

• ·         0.0076g

Please let me know if you have any question.

Aaron

THNAKS FOR YOUR INFORMATION

CAN U PLZ PROVIDE FEW MORE INFORMATION FOR ABOVE

PART ?. 

. Thermal Resistance Junction to Board (Theta JB)

. Thermal Resistance Junction to Case (Theta JC)

Regards,

Jayakumara K

Hi Jayakumara,

I already submitted a request for this device, and it will take several weeks to get the result. I will post the data once I receive them.

Aaron

Hi Jayakumara,

Here is the attachment file for the thermal resistance. Please let me know if you have further question.

Aaron