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TMP513: TMP513 does not show thermal pad in the pin list, and does not say anywhere in the datasheet that it can or can not be connected to, say, ground...

Austin Franklin69
Prodigy 30 points
Part Number: TMP513
Other Parts Discussed in Thread: INA3221

TMP513 does not show thermal pad in the pin list, and does not say anywhere in the datasheet that it can or can not be connected to, say, ground...


Is the thermal pad connected at all on the die?  If so, to what?


This is also true for the INA3221.  Thermal pad not in the pin list, and does not say in the datasheet whether it can or can not be hooked up to, say ground...


It's obviously somewhat common to hook this to ground, but there are cases where the thermal pad is not ground or unconnected, so I won't hook it to anything without knowing it's OK to do.


Thank you,


Austin

  • 0
    TI__Genius 15760 points

    Hi Austin,

    In the INA3221 the thermal pad can be connected to GND. Actually that's what we did in our Evaluation Module (EVM). We called the thermal pad "pin 17" and connected it to GND. See below.

    I will move your question to the temperature sensors forum so the apps team can follow up your TMP513 question. 

    Regards

  • 0 in reply to Mayrim Verdejo
    Prodigy 30 points
    Thanks, though I saw that, I wanted "official" confirmation, and there was no schematic for the INA3221 that showed pin 17/thermal pad at all. BTW, the support link in the TMP513 points to the current sense forum. It's likely because the TMP513 does have one current sense channel?

    What about the INA3221? Is there any reference you can send me that shows that the EVM has pin 17/thermal pad tied to ground? Should I repost asking the question specifically about the INA3221?

    Best Regards,

    Austin
  • 0 in reply to Mayrim Verdejo
    Prodigy 30 points
    Thanks, though I saw that, I wanted "official" confirmation, and there was no schematic for the TMP513 that showed pin 17/thermal pad at all. BTW, the support link in the TMP513 points to the current sense forum. It's likely because the TMP513 does have one current sense channel?

    Best Regards,

    Austin
  • 0 in reply to Mayrim Verdejo
    TI__Mastermind 31650 points
    Hi Austin,

    Thank you for reaching out to us. The die substrate normally connects to GND internally via a very small resistor. For QFN package, yes thermal pad should be connected to GND.

    Hope this helps.

    Aaron
  • 0 in reply to Austin Franklin69
    TI__Genius 15760 points

    Hi Austin,

    What I sent you is the schematic of the INA3221 EVM. You can find the EVM layout and Schematic in the INA3221 EVM website. There is NOT an extra pin, we called (thermal pad) pin 17 in the schematic for reference only. The device only have 16 bond pads and 16 pads on the frame (see below)

    You can see how the thermal pad is connected to GND in the EVM in the PCB diagram below (extracted from INA3221 EVM PCB Layout).

    INA3221-CAMpreview-A.pdf

    The reason the TMP513 website refers to the current shunt monitor website is because the TMP and Current Sense groups used to be one single team, but now we all have our own forums. We apologize for the confusion, thanks for using the E2E forums!

    Regards,

    Mayrim