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LM74: Tin Questions

Part Number: LM74

For part number LM74CIM-3/NOPB can you please assist with the below questions? We are evaluating this device to understand the tin whisker risk. 

  1. What is the process for applying Tin to leads?   Electroplate, Immersion, Hot Dip, etc?
  2. How thick is the Tin?
  3. What is beneath the Tin?  Ccopper?
  4. How is the plating heated?  Annealed?

  • Hello PinkCrapeMyrtle,

    I am currently working on getting this information. I will update you as soon as I have an answer.

    Best Regards,
    Brandon Fisher
  • Hello PinkCrapeMyrtle,

    I apologize for the wait, here are the answers to questions:

    1. What is the process for applying Tin to leads?   Electroplate, Immersion, Hot Dip, etc?
      Electroplating
    2. How thick is the Tin?
      275-787 u-in (7-20 um)
    3. What is beneath the Tin?  Copper?
      Cu Alloy
    4. How is the plating heated?  Annealed?
      Anneal Process post plate

    Please let me know if you have any others.

    Best Regards,
    Brandon Fisher