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LM335: Minimum Temp Limit

James Buckle
Prodigy 30 points
Part Number: LM335

Looking for a little help regarding "out of extremes" limits for hardware. The "intermittent" use limits on the datasheet suggest only higher temperature limits, not lower. I'm looking to find a justification for the minimum temp limit on this component (in SO8 package) - it seems to have a fairly universal temperature limit applied - is this due to testing limits or generic package limits? Ideally I'd like to know the non-op minimum for an LM335.

  • 0
    TI__Guru**** 244380 points
    Hello James,

    The temperature sensors are generally limited by the Silicon temp handling characteristics. Hence the generic minimum temp limit.
  • 0 in reply to Amit Ashara
    Prodigy 30 points
    Hi, thanks for your quick response!

    I'm not sure where those silicon limits come from, what the failure mode is and whether it's permanent. If my sensor is subject to -100C, will it just go out of scale (say full short, or O/C) or will it fracture and fail never to usable again? If I understand the mechanism, maybe I can make a call as to the suitability for occasional high-stress environments.
  • 0 in reply to James Buckle
    TI__Guru**** 244380 points
    Hello James,

    This explanation is provided in the absolute maximum ratings foot note (1)

    Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions . Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
  • 0 in reply to Amit Ashara
    Prodigy 30 points
    There are many cases where taking products out of a positive limit will destroy it, but taking it out of a negative limit will not (but will give unusable results temporarily). There's also cases where doing it 100 times will not destroy it, but doing it 10,000 times will. I guess this is where TI would say "test it yourself" - but I was hoping for an initial understanding before wasting lots of time.
  • 0 in reply to James Buckle
    TI__Guru**** 244380 points
    Hello James

    Subjecting the device to temperatures on both extreme ends subjects the die to mechanical stress. This sort of mechanical stress cannot be quantified easily in terms of hrs of such operation. On top of it during some of the stress, functional operation may also compound the device behavior either temporarily or permanently. Again, these are effects that we cannot quantify or predict as part to part variations affects the behavior.
  • 0 in reply to James Buckle
    TI__Guru**** 244380 points
    Hello James,

    Is there anything else we could help you with?