Can I say Tc=Tj as description in TMP709 datasheet chapter 10.3 as below? If not, how to estimate the Tc(case temperature) for real design?
10.3 Thermal Considerations
The TMP709 quiescent current is typically 40 μA. The device dissipates negligible power when the output drives
a high-impedance load. Thus, the die temperature is the same as the package temperature. In order to maintain
accurate temperature monitoring, provide a good thermal contact between the TMP709 package and the device
being monitored. The rise in die temperature as a result of self-heating is given by Equation 2:
ΔTJ = PDISS × θJA
• PDISS = power dissipated by the device.
• θJA = package thermal resistance. Typical thermal resistance for SOT-23 package is 217.9°C/W.