Hello TI Forum,
My question regard the TMP23X-Q1 is towards where the heat that the component produces directed to? Towards the PCB or towards upwards?
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For the TMP23X-Q1 device, it reports the temperature by reading its own die temperature. For this device, the backside of the die is attached directly to the GND lead. This will be the primary source of thermal conductivity, although the other pins on the device will have an influence as well.
The same method works for the thermal dissipation. The heat will be produced through the lands and traces connected to the device