Other Parts Discussed in Thread: LMT01, LMT87, TMP468, LMT70, TMP108, TMP468EVM, TMP144, TMP411
Hello everyone,
In one of my design, I need to sense MOSFET temperature or/and inductor temperature (TDSON package) which is NOT at ground potential. I first used a resistor divider with a NTC connected to the uC ADC. This solution works pretty well excepts it is dependent of the voltage on the voltage divider and it requires the transport of an analog signal in a noisy environment. I'am thinking replacing this solution by an I2C temperature sensor thus reducing the number of signals (cause I have multiple MOSFET temperatures to measure) and improving the accuracy of the measure.
I notice that the TMP116 had a thermal pad which is not connected to the ground, I thought connecting it to the drain via a copper track to the MOSFET could be a good solution. However, the datasheet clearly states that the thermal pad should not be soldered (at least not to something else than ground).
Does my solution makes sense or should I use an other sensing technique like remote sensing with a diode which would requires the use of an isolated thermal interface (thermal sheet)?
Thank you,
Arthur