Hi experts!
I'm looking for the reliability/qualification report for the TMP461-SP HKU package to address my customer's question.
"Would you please let me know if TI recommends body soldering the following device? If so, could you share any data that the ceramic body does not crack following temperature cycles?"
|
TMP461HKU |
Texas Instruments |
High-Accuracy Remote and Local Temperature Sensor |
They have listed the part number for the EM device but I presume they are interested in the flight part "5962R1721801VXC" in HKU package.
Thank you!
Best regards,
Jim B
