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IWR6843: Thermal considerations of non AoP IC

Dan Thompson
Prodigy 10 points
Part Number: IWR6843


Hello,

Is the Application report SWRA672 - May 2020 applicable for the IWR6843 with the antenna on a PCB instead of the AoP?

The reason for asking is I'd like to give our third party PCB designer the right info regarding the end application to help them with the thermal considerations. If you look at Table 4 it describes various usage examples and how the duty affects the thermal gradient from ambient temperatures.

Can you provide some guidance on this please

  • 0
    TI__Mastermind 25835 points

    Hello Dan,

        Application note is developed specifically for the AOP device. High level concepts are generic for example scaling of thermal resistance with the board size, Heatsink design, Duty-cycle effects on the junction temperature, Some of the PCB layout concepts are generic and would be applicable for non-aop device as well, however some of the numbers and trade-offs done in the application note is for the AOP device and EVM. Table 4 uses thermal resistance/characteristics of the AOP chip and associated components, hence it may not be exact representative for the non-AOP devices. 

    We would encourage to perform thermal simulations for making the right trade-off for the thermal designs. 

    Thanks and regards,

    CHETHAN KUMAR Y.B.