HDC2021: Clarification on no-clean solder paste

msech

Part Number: HDC2021

Hello,

The HDC2021 datasheet contains conflicting information in regards to reflow. Section 3 says that the tape cover provides protection during PCB board wash. However, section 10.1.1.2 states that no-clean solder paste is mandatory, and that a water wash is not allowed.

This thread indicates that a no-clean process is not required for this part.
https://e2e.ti.com/support/sensors/f/1023/t/956376?tisearch=e2e-sitesearch&keymatch=HDC2021

I am inclined to believe the part is tolerant to a board wash. Is anyone able to provide a final determination on this?

Thanks,

Mike

over 4 years ago

0 Brandon Fisher94 over 4 years ago

TI__Mastermind 28070 points

Hi Mike,

Welcome to the E2E forums.

You are correct that the HDC2021 is okay for board wash and is therefore fine with a water-soluble solder paste, provided the tape is not removed.

That portion of section 10.1.1.2 is holdover from our other HDC2 family of devices and is still accurate if the tape is removed. The relationship between the protective tape and assembly is probably better expressed in section 10.1.1.3 and in section 3. We will have to re-evaluate this section to see if it can be reworded for more clarity.

Best Regards,
Brandon Fisher

0 msech over 4 years ago in reply to Brandon Fisher94

Prodigy 20 points

Thank you for the clarification, Brandon!

Mike

0 Josh Wyatt over 4 years ago in reply to msech

TI__Guru* 91206 points

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HDC2021: Clarification on no-clean solder paste