The DRV5032DUDMRR is being considered for use.
In the data sheet, VIA is recommended for thermal pads in the section on footprints.
However, in consideration of component mounting, we are considering not installing VIA.
We understand that the role of the thermal pad in the DRV5032DUDMRR is mechanical reinforcement rather than heat dissipation.
For this reason, we believe it is unnecessary to provide VIA.
Is my understanding correct?
Are there any risks associated with not installing VIA?