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LMT70: defective solder joints component ball

Part Number: LMT70

Hi sensors team,

my customer has the following problem:

As you can see in the upper left picture (screenshot F3 PIN Luftspalt.jpg) the solder joint at the upper end (component side) is cracked or not homogeneous.

About the product:
The heating-cooling cycles are as follows
60 - 110°C within ~5 seconds
110 - 60°C within ~6.5 seconds
these temperature cycles are run up to 100x per hour.

According to the paste manufacturer's info, above "stress" is not a problem, what about the BGA solder?

The BGA is soldered on a flex PCB.

As an attachment your data sheet for assignment.
A data sheet of the solder paste (SAC305) is also attached.

6600 7000 TI-.pdf7306 0048 Almit LFM-48W MR-NH.pdf