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Original question:

HDC1080: HDC1080 internal information need

HDC1080: Accuracy Deviation of HDC1080 Storage after Half a Yea

HY yang
Expert 1960 points
Part Number: HDC1080

Our Customer use HDC1080 design temperature and humidity sensor encountered quality problems. After six months of storage, the humidity of all products increased by about 4% compared with half a year ago, and the temperature measurement is still accurate. Our Customer have already processed the patch according to the suggestions they received before. The patch HDC1080 does not use reflow soldering, but uses a thermostat. In view of this problem, customers hope to get TI more effective suggestions to help them design high-quality products

  • 0
    TI__Guru* 90906 points

    Dear HY yang - 

    can you elaborate more about the way they are assembling the HDC device?

    The HDC1080 datasheet has the Implementation and Usage Recommendations here: http://www.ti.com/lit/ds/symlink/hdc1080.pdf on page 18, which instructs to use no-clean solder paste and no board wash after an IR Reflow. The next section is covering the avoidance of exposure to particulates or solvents, etc.  Also, how are the units stored directly after assembly and then while they were packaged? 

  • 0 in reply to Josh Wyatt
    Expert 1960 points

    hello,

    Welding and storage environments are shown in the pictures. Do you need more information?

  • 0 in reply to HY yang
    TI__Guru* 90906 points

    Dear HY yang - 

    storage environment looks ok, the packaging may need to be checked for outgassing, as well as the PVC pipe. I looked on the website of these products

    , but i did not find any manual which explained what was in the packaging or what the housing is made of (i am assuming that is PVC, but it may be PTFE or another material. these materials may outgass VoCs, which are known to affect any polymer based humidity sensor. 

    With regards to the method of assembly, we recommend the use of IR reflow. I don't think we have knowledge here of using a hot plate as you are showing here, how can the solder profile be managed with this kind of device? The method of assembly may have affected the sensor. 

    are you working with any TI Sales or Applications people locally?

  • 0 in reply to Josh Wyatt
    Expert 1960 points

    we have connet local fae,sales and IQC for help.