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Part Number: HDC1010
Please you kindly review below picture, my customer was use HDC1010 measure Humidity(RH%) data compare with machine value have arround 7% error.
Please you kindly review and help provide advise.
Dear Steven -
What was solder profile during assembly?
Did the assembly house re-hydrate the units after assembly?
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In reply to Josh Wyatt:
Didn't have re-hydrate the units.
In reply to Steven He92:
please refer picture, customer use TI_HDC1010 EVM with customer P.C.B to do test in burn-in chamber.
as you see chamber RH% with EVM/ CTMR_P.C.B. have big gap.
May know how: how to test HDC1010 EVM TI lab?
Why have this huge gap? please you kindly review & provide suggestion.
Would you please answer my first questions?
Also, are they looking at their chamber setpoint or do they have reference probe? (like dew point mirror?)
seeing as how the HDC devices seem to correlate fairly well here, seems the chamber value is off or something of that nature is going in.
in this issue, I only let HDC1010 woking the meaure humidity will be more accuracy(our P.C.B HDC1010 bottom have ground plane).
I saw a application note_ Optimizing Placement and Routing for Humidity Sensors, page9~14 have mention how to place HDC1010.
Could you advise:
1. for example_ fig10 HDC1010 how long distance with GND Plane that will be batter ?(my P.C.B is FR4 and 4-layer)
2. have any method to compensation this thermal issue(P.C.B thermal issue will effect humidity accuracy)?
Dear GH -
Please see Sections 2.3 and 4 Appendix: Determining Thermal Conduction through the PCB. In your case, it looks as though you may not have isolated the sensor as we recommend in these areas. You would want to re-design somewhat to do that, for best thermal performance. If this is not an option and the conducted heat rise impact on each board is the same, then you would be able to offset the part for both temp and humidity.
Did you double check your chamber, too? Do you have a calibrated reference?
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