Hello,
the datasheet recommends vias in the DAP: (Page 20, Figure 18)
The routing and placement document recommends to use no vias: (page 15, 2.4 - 1st dot)
I have a 4-layer-pcb and there are no traces, pours, .. below the sensor on the bottom side. Should I use vias that connect to a second floating pad on the bottom side of the pcb to make better heat dissipation or should any copper on the bottom side be cut out?
Should the copper on the middle pcb layers be cut out or also used as via-connected floating pads?
thanks a lot in advance
mhein