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[FAQ] HDC2080/HDC2010 - Are there any guidelines for surface mount assembly and environmental handling when using the HDC devices?

Other Parts Discussed in Thread: HDC2010, HDC2080, HDC1010, HDC1080

Are there any guidelines for surface mount assembly and environmental handling when using the HDC devices? 

  • The following recommendations are applicable to all devices in the HDC family (not just the HDC20xx family)

    1. HDC 2010 Data Sheet – Section 10.1.1 Guidelines for HDC2010 Storage and PCB Assembly. This section briefly discuss key topics on soldering reflow, rework, simultaneous exposure to high temp & high humidity, and Bake/Re-Hydration Procedure.
    2. HDC 2080 Data Sheet – Section 11.1.1 Guidelines for HDC2080 Storage and PCB Assembly. This section briefly discuss key topics on soldering reflow, rework, simultaneous exposure to high temp & high humidity, and Bake/Re-Hydration Procedure.
    3. Humidity Sensor: Storage and Handling Guidelines. This application note describes storage and handling guidelines of humidity sensors, including the HDC1010, HDC1080, and HDC20XX.