• State TI Thinks Resolved
  • Locked Locked
  • Replies 3 replies
  • Answers 1 answer
  • Subscribers 31 subscribers
  • Views 266 views
  • Users 0 members are here
Support feedback
Options
Options
Similar topics

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TMP117: ESD protection

Frederic Griffe
Expert 1715 points
Part Number: TMP117

I plan to use the TMP117 sensor for temperature measurement. The sensor will be positionned ate the surface of the product's casing.

How can I protect this sensor against 15kV contact ESD discharge ?

Kind regards. 

  • 0
    TI__Mastermind 27635 points

    Hi Frederic,

    Thank you for your post. The TMP117 has very good internal ESD protection for production purposes, but to meet 15kV contact you will need discrete protection. Will the sensor be exposed at the product's case, or will it be under some kind of contact?

    Best Regards,
    Brandon Fisher

  • 0 in reply to Brandon Fisher94
    Expert 1715 points

    Hello Brandon,

    Yes the sensor is at the surface of the product's case and in contact with the outside air.

    To get the best contact with the outside air we extend the thermal pad slightly outside the component surface (see picture below surface P$2).

    So the question is based on the above layout where shall we put the discrete protections ?

    Kind regards.

    Frederic

  • 0 in reply to Frederic Griffe
    TI__Mastermind 27635 points

    Hi Frederic,

    Protecting the TMP117 from 15kV direct contact ESD may be challenging, since you would typically have a contact or connector that you could connect to ground via a TVS diode or similar ESD protection technique to bypass the TMP117.

    If you will be applying a direct 15KV pulse to the TMP117 you can try placing an appropriate TVS diode for each non ground pin connection (i.e. one for VCC, one for SDA and one for SCL) as close as possible to the device. That way when an ESD event occurs you are providing all possible low-impedance paths to ground.

    Best Regards,
    Brandon Fisher