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Part Number: TMP461-SP
I am looking over the displacement damage report for the TMP461-SP (report SBOK034) and have a question on the temp error data shown on page 21 (attached). Per the data in the table, it appears that the Delta is much greater at lower fluences than higher... this seems off... Can someone explain what is happening? Does the parameter tighten up with fluence to start and then get worse as it gets higher? Is the report in error?
I'm looking into this and will get back to you shortly.
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I am still researching this issue. I apologize for the delay. I expect to have a call with the engineer that collected this data tomorrow.
I don't think the report is in error. The absolute delta from pre to post testing was greater for temperature error measurements at lower fluences. It would seem that the data was flipped or otherwise mishandled with regards to fluence. If you look at other devices and tests, you can see there isn't a consistent trend of parameters getting objectively worse. Current consumption, for example, decreases. The exposure causes changes to transistor characteristics. The way the transistors are used in the design is complex, and the changes to the characteristics may or may not have a significant impact on how the overall circuit functions. Many semiconductor design techniques specifically target eliminating adverse effects from transistor variations. It's quite difficult for us to sum all of this and predict how exposure will affect performance.
This test is not reviewed for its trends. It's used to predict failures. TI conducts the test to show that our device still meets its specifications after exposure. Other tests are analyzed in a different light, but this is the purpose of this test.
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