The datasheet lists the thermal response time as follows:
Thermal response time to 63% of final value in still air: 73sec (dominated by PCB see layout)
1. I can't find anything about this in the layout section.
2. Under what conditions was this testing performed? PCB substrate, test setup, layout, etc...or is this just theoretical?
There are a bunch of app notes talking about the LMT70 for wearable applications, etc...and these have detailed information on setup for skin-contact, showing response times of around 20s or so for 63%...
So I was hoping for some detailed info on the "in still air" setup, and how the response time was measured, PCB layout was done, etc...
The end-use is for CJC, so the device would probably be attached to a thermal isolation block via thermal epoxy/glue...