LMT70: Best surface for temperature conduction to die?

Scott Brenneman

Part Number: LMT70

I'm seeing what appears to be conflicting information. Elsewhere on this Forum is a thread in which a TI employee says that most of the thermal conduction for the LMT70 is through the balls on the underside of the case, and this is echoed by the app note on PCB layout for temperature sensors. However, in the datasheet (Section 8.4) the lowest thermal resistance by far is from junction to case top. Junction-to-board, which is using the path through the BGA balls, is more than an order of magnitude poorer.

Please help clarify this apparent discrepancy.

Thanks,
Scott

over 3 years ago

0 Ren Schackmann over 3 years ago

TI__Mastermind 35895 points

Hi Scott,

The data does not lie. It's often not practical for customers to attach to the top of the IC in production, so we try to avoid suggesting this.

thanks,

ren

0 Scott Brenneman over 3 years ago in reply to Ren Schackmann

Genius 3265 points

Hi Ren,

Makes sense (phew!) and good to know. I do think your audience would be helped by knowing the ideal option, since some of us would be able to do it.

Thanks,

Scott

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LMT70: Best surface for temperature conduction to die?