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Original question:

TMP513: TMP513 does not show thermal pad in the pin list, and does not say anywhere in the datasheet that it can or can not...

TMP513: Center Pad Vias Required

x123x
Prodigy 150 points
Part Number: TMP513

I saw in the related question that the QFN pad should be connected to ground. I had the same question, as it is not mentioned in the datasheet (maybe worth updating the datasheet to mention this?). Ok, so I'm connecting it to ground at least by connecting to pin 14. However, does this center pad also need in-pad vias to connect to the ground plane beneath this chip? I assume this chip doesn't require that from a thermal perspective, but does it help with noise performance on the ADC?

  • 0
    TI__Mastermind 35895 points

    The thermal pad can be connected to GND or left floating. It doesn't require vias. You're correct that it doesn't need the via material to conduct heat away from the chip as it does not have high current consumption. The ADC is not affected by the thermal pad, either.

    thanks,

    ren