Hi, I'm an enginner in KOREA.
I have a question about the best way to mount AWR6843 on PCB.
There are a lot of worst cases like drop, bumping, impact when the ECU/Unit with AWR6843 is assembled in car.
Also the car OEM has test spec and require test report to check whether it has an issue or not when the ECU is exposed to the worst cases.
So, we are considering under fill process in line to enhance bond strength.
Is it okay to adjuct under fill process for operating normally?
We are worried that if material which is sticky overflow on the feed to antenna, it would cause malfunction of antenna.
we'd like to know the best way to meet customer's requirement and to operate normally.
Thanks.