Hello,
I was wondering if I need to account for the wire bond length difference in the TX/RX and LVDS lines on the PCB routing, or if these traces should just be length match on the PCB layout.
Thanks
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Hello,
I was wondering if I need to account for the wire bond length difference in the TX/RX and LVDS lines on the PCB routing, or if these traces should just be length match on the PCB layout.
Thanks
Hi Vivek,
What about the 77GHz TX and RX lines? Are these matched inside the chip?
Thanks
Hello Robert,
Under NDA we can provide HFSS models of the die + package. You need to match the RF transition to the PCB based on the impedances in the model. If you use the same PCB stackup (RF layer) as we have used in our EVM then you could just copy the transitions from our EVM design. If you are using the different stackup then you might need to tweek it a bit to match the impedance.
Regards,
Vivek