Hello all,
I am designing a level sensor for a small flume (trapezoidal top width = 16 cm, side height = 11 cm and bottom width = 5 cm). Water will flow in the flume and the depth of water is used to calculate the discharge. My plan is to use the Oop technique to design a level electrode running the 11 cm side of the flume. Because water will intermittently flow in the flume, my plan is to place the reference electrode at the 5 cm bottom of the flume. Both level and reference electrodes will be printed on flex pcb to conform to the profile of the flume so the reference is taped at the bottom and faces up while the level electrode runs along the side of the flume (see attached picture for a rough idea). Any thought on my approach? In folding the flex sensor at the bottom of the flume, is there any concern that the symmetry requirement of the Oop method might be violated? Is there any noise susceptibility issues that would arise the fold in the flex pcb? Also, the flume will sit directly on the ground so the reference electrode will be touching the ground. Will the active shield layer (SHIELD1) on the back of the reference electrode be enough to block the effect of moisture in the soil from interfering with the measurements? How about unexpected excessive pressure on the flume? Will this deform the pcb insulation between shield and reference enough to make any difference in measurement?
Any other issue I need to consider?
Thanks in advance for your feedback,
Kossi
