Does TI sell flip-chip, daisy-chain die (chip, IC) that can be used to check continuity and assembled for Coefficient-of-Thermal-Expansion testing (preferably with 63/37 SnPb bumps)?
Page 9 of your document at
www.ti.com/.../spraa99b.pdf
states “Texas Instruments offers daisy-chained units in all production nFBGA packages.” However, I’m unable to find them on the ti.com website. I'm only interested in the flip-chip die (chip, IC), not the entire package. If you do offer them, would you please give me more information (including pricing and minimum order quantities)?
Sincerely, John Masnik