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TS5A23166: Question about the structure of DSBGA

Part Number: TS5A23166

Hello TI experts,

I found the material contents of TS5A23166YZPR in, there are only semiconductor and solder bump only.

i think that i can see backside coating in the material of TS5A23166YZPR in the past, but I cannot see it now.

is there have been some changes for this device? or my memory is wrong?

(I can see the material of backside coating on TPS62361BYZHR. is there any standard about this? some have backside coating, some don't have..)

and one more question, could you provide some structure diagram of DSBGA without backside coating?

please check this issue. Thanks.

Best regards,