Customers have asked the following questions to register their products. Can you give me more details?
Material: TS5A63157DBVR
1. Use Ni for grounding or not. : Yes / No
2. Thickness of outermost layer plating : 10 μm or more / Less than 10 μm
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Customers have asked the following questions to register their products. Can you give me more details?
Material: TS5A63157DBVR
1. Use Ni for grounding or not. : Yes / No
2. Thickness of outermost layer plating : 10 μm or more / Less than 10 μm
As shown on ti.com/quality-reliability-packaging-download/report?opn=TS5A63157DBVR, this device is made at two assembly sites. One uses NiPdAu lead frame plating, the other one uses pure Sn.