Hi TI team,
PCN# 20240411005.1 was released for CD74HC4051M96.
I have serveral questions reagrding this change notice,could you please help to check them out?
1.CD74HC4051M96 should belong to group 3 in this change. The changes are adding new assembly materials for exisitng assembly site(FMX), but not adding FMX as an additional assembly site. Is this understanding corret?
2.Does wire in assembly material mean bonding wire in the PCN?
3.Please briefly explain the difference between mold compound and mount compound.
Thank you.