SN74HC4851-Q1: Construction materials P/N SN74HC4851QPWRQ1 RFI

Tomás Reverte

Part Number: SN74HC4851-Q1

Tool/software:

Dear Sirs,

Could you provide the information requested in the beneath table for the P/N SN74HC4851QPWRQ1 please?

Part CTE		PCB CTE			Leadframe Base Material (e.g., copper)		Plating Materials & Thicknesses (inner layer(by%)/outer layer(by%)) [e.g., Ni 0.001-0.002µm/(98%Sn-2%Bi) 0.010-0.20µm]		Wire Bond Material (e.g., gold, copper, alloy)
		X	Y	Z							If Copper wire bond is the part AECQ006 Qualified Y/N

Thanks!

Best regards,

Tomas Reverte

over 1 year ago

0 Rami Mooti1 over 1 year ago

TI__Mastermind 35648 points

Hi Tomas,

You can find some of this information from the product page

https://www.ti.com/quality-reliability-packaging-download/report?opn=SN74HC4851QPWRQ1

Bond wire material, Lead frame material and plating material are all there with a breakdown of their compositions.

The Cu base metal will have a CTE of around 17ppm/C and the NiPdAu coating will be around 13ppm/C

Almost all our multiplexers devices (I work for the mux team so I can't necessarily speak for all of TI but I'm sure that statement is true as well) will be AEC-Q006 rated.

Thanks,
Rami

0 Tomás Reverte over 1 year ago in reply to Rami Mooti1

Prodigy 10 points

Dear Rami,

Thanks for the provided information. It was very helpful.

Regarding this issue, we would like you to provide information regarding CTE part in terms of below and above Tg. Could be possible?

CTE1 (below Tg) = X

CTE2 (above Tg) = Y

Thanks in advance.

Best regards,

Tomas Reverte

0 Rami Mooti1 over 1 year ago in reply to Tomás Reverte

TI__Mastermind 35648 points

Hi Tomas,

I'm looking internally to see if I can find this information. I'll update you as I learn more

Thanks,
Rami

0 Tomás Reverte over 1 year ago in reply to Rami Mooti1

Prodigy 10 points

Hi Rami,

Did you have a chance to see if you can provide this information please? Customer is requesting it persistently to be able to do a better comparison with your competitor´s device and replace it by yours.

Thanks!

Tomas

0 Rami Mooti1 over 1 year ago in reply to Tomás Reverte

TI__Mastermind 35648 points

Hi Tomas,

I have reached out to our packaging team who would have more specifics but unfortunately the time table for an update they gave me will be next week so I won't be able to provide a quick answer on this. I'll keep you update as they give me more information but I'm also waiting on my end as well

Thanks,
Rami

0 Tomás Reverte over 1 year ago in reply to Rami Mooti1

Prodigy 10 points

Hi Rami,

Thanks for your support! I pass the information to my customer and we look forward to hearing from you.

Best regards,

Tomas

0 Tomás Reverte over 1 year ago in reply to Tomás Reverte

Prodigy 10 points

Hi Rami,

Have you received the information from your packaging team?

Looking forward to hearing from you.

Many thanks!

Tomas

0 Rami Mooti1 over 1 year ago in reply to Tomás Reverte

TI__Mastermind 35648 points

Hi Tomas,

Yes the feedback was by the end of this week so I'll nag them a little today or tomorrow for us and again on Friday if we still haven't heard by then

Thanks!
Rami

0 Rami Mooti1 over 1 year ago in reply to Rami Mooti1

TI__Mastermind 35648 points

Hi Tomas,

I've got an update this morning that isn't the best. Looks like the packaging team ran into some simulation issues so they've pushed the timeline to next week.
Sorry for the delays on this. I'll keep updated you as soon as I get more

Thanks,
Rami