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TS5A23157: Datasheet Revision Change from Rev E to F

neha pandey
Prodigy 130 points
Part Number: TS5A23157

Hi, 

On comparing the Rev E and Rev F datasheet for Part number TS5A23157, I found that the thermal resistance has changed for DGS (VSSOP) part from 56 C/W to 21.5 C/W, Can you please confirm on this change and do tell what was the change in the part that led to this change?

Thank You 

NEHA PANDEY

Stryker, India

  • 0
    TI__Genius 9132 points

    Hi Neha,

    There are many factors that go into the thermal metrics which are modeled on the JEDEC High-K board. Variables like ambient temperature, humidity, wind etc. are subject to change for different thermal model setups and cause differences between the thermal metrics.

    The RθJA specifically is a variable function of not just the package, but of many other system level characteristics such as the design and layout of the printed circuit board (PCB) on which the part is mounted.

    We always want to provide our customers with as accurate information as possible; therefore, from time to time as our modeling process improves we may update our Thermal Information table on a datasheet revision.

    It is best if you do your own measurement in your application setup and use this application note "Semiconductor and IC Package Thermal Metrics" and the TS5A23157 datasheet for guidance.

    Regards,

    Saminah

  • 0 in reply to Saminah C
    Prodigy 130 points

    Hi Seminah,

    Thank you for providing the inputs.

    Please confirm that there is no change in the TS5A23157 component  as our product is already in production and the Rev E to Rev F is just an updation of a incorrect value of thermal resistance(junction to ambient) given. 

    Thank you

    NEHA

  • 0 in reply to neha pandey
    TI__Genius 9132 points

    Hi NEHA,

    Yes, there is no change in the  TS5A23157 component. Only the thermal data was updated with the correct value.

    Thanks

    Saminah