Part Number: SN74LVC2G66
Dear TI Team
When I investigated the reflow conditions of SN74LVC2G66DCUR, I found the following materials. Is it okay to carry out reflow according to this? If you have other materials, I would appreciate it if you could share them.https://www.ti.com/lit/an/snoa550h/snoa550h.pdf
Hi Y. Ottey,
The reflow specs in here are for TI Surface mount devices (SMD's) -this looks like its the most up to date specs - it is okay to follow this along with the following standards - for reference: IPC-J-STD-004, IPC-JEDEC J-STD-020, and IPC-JEDEC J-STD-033. These are industry standard specs that TI typically adheres to in the manufacturing process.
As a note - it is also mentioned in the brief - Reflow is okay when you follow the guidelines listed in that document but don't use wave soldering for SMD devices as this is not recommended.
If you have any other questions please let me know and I will see what I can do!
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