Hi,
We are using the following TI components in our design.
TPA3111D1PWP |
LM25085SD |
LM5175RHF |
CSD19531Q5A |
MSP430F5659IPZ |
TPS7A1901DRB |
CSD18537NQ5A |
TPS23861PW |
LM5022MM |
Can you please provide the .pdml files, so that we can carry out thermal simulation?