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Part Number: TIDA-00489
Hey guys. We have encapsulated approx. 25 TIDA 00489 modules with resin (I currently do not know the exact name of the resin, if you need it let me know). The TIDA modules were placed into some prototype 3D print housing and afterwards encapsulated to use them outdoor and protect them from humidity and other aggressive gases which could degrade the electronics over time. The only part visible from outside the chassis is the lens.
However, right after the encapsulation, the sensors started to detect non existing movements. The sensors were lying in boxes, completely isolated from the environment, so the resin could harden. There were definitely now movements or quick external heat variations triggering a signal, but after 5 mins the sensors detected 100 - 15,000 movements. Sometimes more, sometimes less. Only two sensors were still working the way they should. We have waited now for approx. 2 weeks but still only slight better behavior of the sensors.
Summary: After encapsulation, the sensors detect movements although there are definitely no movements. Only 2 out of 25 still work. 1 sensor even stopped completely to detect any movement at all.
Question: Do you have any experience, how a resin, which purpose is encapsulating electronics could cause such a behavior? Could you give us some advice what kind of resin to use in the future for sub GHz applications outdoor?
We have not tried to encapsulate the TIDA-00489 design so unfortunately I have no basis to know which components may be sensitive to this process. I will reach out to our packaging group to find out if they may be able to offer some insight.
In the meantime, it may be worthwhile contacting the sensor manufacturer to determine if the package/internals of the sensor itself is sensitive to the encapsulation process. Is this design using the surface mount sensor used in the TIDA-00489 design?
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In reply to David Stout:
David StoutIs this design using the surface mount sensor used in the TIDA-00489 design?
yes in this badge it is the surface mount one. The next badge will have the other sensor type.
Thanks for reaching out. I will be waiting for further input.
In reply to Slev1n:
From our packaging group:
"There are two devices on the BOM that may be sensitive to coating material. The CC1310 Wireless Microcontroller and the PIR Motion sensor.
The CC1310 was qualified (both component and board level) without coating. Depends on the coating material being used, it may affect its RF function and the sensitivity of the PIR Motion sensor.
Suggestion to customer is to block off these 2 components during the encapsulation process."
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