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TIDA-01173: layout question on OPT8241

Part Number: TIDA-01173

I have a layout question about OPT8241.

in the data sheet(page 26), "not soldered to expose die" was be mentioned.

I think it meaning that we should not open the solder mask(center ground pad) under the OPT8241.

But after I check the EVM board file. TIDA-01173 open the solder mask (center ground pad) under the OPT8241.
Is this correct? we need to open the pad under OPT8241 or not?

or we only need to open it on PCB, but close it on solder stencil?


please help to check & confirm .

Peter