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Other Parts Discussed in Thread: TIDM-RF430-TEMPSENSE


I would like to manufacture the reference design TIDM-RF430-TEMPSENSE from NextPCB online PCB quote page as a Flexible Polyimide PCB. However, I'm not sure which options I should select. Could you please give advice for the following manufacturing options? In addition, should the drill layer be made as A.Tenting vias, B.Plugged vias, or C.Vias not covered?