Because of the Thanksgiving holiday in the U.S., TI E2E design support forum responses may be delayed the week of Nov. 21. Thank you for your patience.

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TIDM-RF430-TEMPSENSE: PCB quote

Other Parts Discussed in Thread: TIDM-RF430-TEMPSENSE

Hello,

I would like to manufacture the reference design TIDM-RF430-TEMPSENSE from NextPCB online PCB quote page as a Flexible Polyimide PCB. However, I'm not sure which options I should select. Could you please give advice for the following manufacturing options? In addition, should the drill layer be made as A.Tenting vias, B.Plugged vias, or C.Vias not covered?
Thanks!