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PMP4435: Board Stack up Reference

Jejomar Ildefonso
Genius 9390 points
Part Number: PMP4435

Hi Team,

Our customer is looking for the board stackup used in reference PMP4435 design. We are pertaining to the way the PCB that PMP4435 is based on is constructed.

We're able to locate the layout document containing the layers, but our customer needs to know what the copper to prepreg/core ratio is in order to evaluate how to adapt this into their design. Do we have this available?

Thanks in advance!


Kind Regards,

Jejomar

 

  • +1
    TI__Expert 4620 points

    Hi Jejomar,

    I found PMP4435 layer stack up as below:

    Layer Name Type Material Thickness (mm) Dielectric material Dielectric constant
    Top Overlay Overlay
    Top Solder Solder Mask/Coverlay SurfaceMaterial 0.01016 Solder Resist 3.5
    Top Layer Signal Copper 0.07112
    Dielectric1 Dielectric Prepreg 0.1 FR-4 4.8
    Layer01 Signal Copper 0.10668
    Dielectric2 Dielectric Prepreg 0.1 FR-4 4.8
    Layer02 Signal Copper 0.10668
    Dielectric3 Dielectric Prepreg 0.1 FR-4 4.8
    Layer03 Signal Copper 0.10668
    Dielectric4 Dielectric Prepreg 0.1 FR-4 4.8
    Layer04 Signal Copper 0.10668
    Dielectric5 Dielectric Prepreg 0.1 FR-4 4.8
    Layer05 Signal Copper 0.10668
    Dielectric6 Dielectric Prepreg 0.1 FR-4 4.8
    Layer06 Signal Copper 0.10668
    Dielectric7 Dielectric Prepreg 0.1 FR-4 4.8
    Layer07 Signal Copper 0.10668
    Dielectric8 Dielectric Prepreg 0.1 FR-4 4.8
    Layer08 Signal Copper 0.10668
    Dielectric9 Dielectric Prepreg 0.1 FR-4 4.8
    Layer09 Signal Copper 0.10668
    Dielectric10 Dielectric Prepreg 0.1 FR-4 4.8
    Layer10 Signal Copper 0.10668
    Dielectric11 Dielectric Prepreg 0.1 FR-4 4.8
    Layer11 Signal Copper 0.10668
    Dielectric12 Dielectric Prepreg 0.1 FR-4 4.8
    Layer12 Signal Copper 0.10668
    Dielectric13 Dielectric Prepreg 0.1 FR-4 4.8
    Layer13 Signal Copper 0.10668
    Dielectric14 Dielectric Prepreg 0.1 FR-4 4.8
    Layer14 Signal Copper 0.10668
    Dielectric15 Dielectric Prepreg 0.1 FR-4 4.8
    Layer15 Signal Copper 0.10668
    Dielectric16 Dielectric Prepreg 0.1 FR-4 4.8
    Layer16 Signal Copper 0.10668
    Dielectric17 Dielectric Prepreg 0.1 FR-4 4.8
    Layer17 Signal Copper 0.10668
    Dielectric18 Dielectric Prepreg 0.32004 FR-4 4.8
    Layer18 Signal Copper 0.10668
    Dielectric19 Dielectric Core 0.32004 FR-4 4.8
    Bottom Layer Signal Copper 0.07112
    Bottom Solder Solder Mask/Coverlay SurfaceMaterial 0.01016 Solder Resist 3.5
    Bottom Overlay Overlay