Tool/software:
The datasheet for the SN74FB1653PCA indicates a PowerPAD package with an exposed thermal pad on the bottom of the device to be soldered to the board for heatsinking. However, the ICs I purchased and received do not have any exposed thermal pad on the bottom of the device. Has the packaging changed to only be used with an externally attached heatsink or am I missing something on the bottom of the chip?





