Other Parts Discussed in Thread: AMC1301
In TIDA-00281 i have observed that Driver Board Ground(GND_B) is common with the External MSP Launch Pad.
As per my understanding Launch Pad Ground and Driver Ground(GND_B) must be Separated or Isolated by galvanic isolation for safety and reliability.
Why this kept common in this design?
As we know ,when MOSFET switch there will be switching noise in ground and that Noise might go to Lauch Pad and can Reset MCU or can damage it if Spikes have enough high voltage.
(1)Why Ground Kept common in TIDA-00281?
(2)When to have galvanic isolation between Launch Pad and driver Card like opto coupler etc? any Special Considerations?
additionally with this i have one more concern which i am describing below.
Let's say i have used Galvanic isolation between Lauch Pad and Driver card by Opto-coupler. With this configuration how can i manage Voltage and Current sense signals.