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LAUNCHXL-CC2640R2: how to change GAP_BONDINGS_MAX

Alexander
Prodigy 70 points
Part Number: LAUNCHXL-CC2640R2
Other Parts Discussed in Thread: CC2640

Hello,

I use ble5stack with project_zero as a basis and CC2640r2-sdk-5.10.

I need to change GAP_BONDINGS_MAX to 5. Default for CC2640 is 6. I test it by connecting 7 devices and verify which reconnect gets rejected.

Unfortunatly I am not able to change GAP_BONDINGS_MAX in the project scope.

Adding a compiler flag -DGAP_BONDINGS_MAX=5 has no effect and changing the GAP_BONDINGS_MAX define in gapbondmgr.h has also no effect.

Interestingly, when I change GAP_BONDINGS_MAX  in the gapbondmgr.h in the SDK it works as expected. It seems like there is an issue with two header files with same name.

One is in C:\ti\simplelink_cc2640r2_sdk_5_10_00_02\source\ti\ble5stack\host\gapbondmgr.h and the other one is under ~\ble5_project_zero_cc2640r2lp_app\Include\gapbondmgr.h.

I am not sure if I do something completly wrong or if I found some issue with the example project...

Thats why I am asking:

Is there a proper way to change GAP_BONDINGS_MAX within the project folder?

regards

Alex

  • 0
    TI__Mastermind 27680 points

    Hi Alex,

    Can you go into properties->include options and change the order of the search paths so the SDK include path is below the include path like the picture below? As I understand, the order of the includes is what determines which files get used when they're both #included.

    Let me know if that works.

    Best,

    Nate

  • +1 in reply to Nathan Block
    Prodigy 70 points

    Hi Nate,

    your suggestion is good but it did not work.

    The proper way is to add "-DGAP_BONDINGS_MAX=5" in the corresponding stack project under TOOLS/defines/ble5_project_zero_cc2640r2lp_stack_library_FlashROM_Library.opt

    Thank you for your help.

    regards

    Alex