Can TI make a suggestion for the layer stack for the CC2640R2F package?
Is it OK to use a 4 layer board or would it be better to go with a 6 layer?
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The 'Stack Up' recommendation in Figure 4-1 of the swra640f.pdf document answers the question well for the 7x7, 5x5 and 4x4mm packages. However, it's not obvious how this "Stack Up' applies to the 2.7x2.7mm BGA package?
As you're probably aware the 2.7mmx2.7mm package has very different requirements. For 1, the balls on the BGA package are so close together, it's impossible to rout traces between them on the same layer. This means many of the signals must first be routed to inner layers using vias (via-in-pad) before they can then be 'spread outward' and then routed away from the part. One obvious way to do this is to add 2 inner signal layers, coming up with a 6 layer stack up. What may not be so obvious is how the layout could be accomplished in 4 layers. Is there more information available on the subject of the BGA layout?
Can you tell me the Trace width and space for the https://e2e.ti.com/support/wireless-connectivity/bluetooth-group/bluetooth/f/bluetooth-forum/1102139/cc2640r2f-can-you-suggest-a-layer-stack-for-the-cc2640r2f-part#:~:text=http%3A//www.ti.com/lit/zip/swrc336