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CC2340R5: need to know about bond information replacement

vignesh s
Intellectual 533 points
Part Number: CC2340R5


Hi,

We are using CC2340R5 basic ble-oad peripheral code.

I need to know 

- What is the maximum number of devices that can be bonded with the BLE module?
- If the max. limit for the bonded device information is reached, then what is the strategy to bond the next device?

In syscfg--> bond manager--> maximum number of supported bonds is set to 10 devices
By default LRU bond replacement has been disabled(False).I have  attached an image regarding Bond Manager.


CCS: code Composer Studio 12.5.0   - SDK : simplelink_lowpower_f3_sdk_7_20_01_10

Thank you.

  • 0
    TI__Mastermind 42420 points

    Hi,

    vignesh s said:
    - What is the maximum number of devices that can be bonded with the BLE module?

    The maximum number of bonds will be defined by the value set in "Maximum Number of Supported Bonds." Each bond consumes some NVS space, so the actual max will depend on how much NVS is available for use. Some more information may be found in the GAPBondMgr and NV

    vignesh s said:
    - If the max. limit for the bonded device information is reached, then what is the strategy to bond the next device?

    If LRU Bond Replacement is enabled, then the least recently used bond will be the one deleted to bond the next device. If LRU Bond Replacement is disabled, then no future bonds will be able to be saved.

    Best Regards,

    Jan