I'm working with the CC2650 Host Test SPI Example with the CC2650 configured as a peripheral.
I have activated the following build options for the TI Bluetooth stack:
-DHOST_CONFIG=PERIPHERAL_CFG
-DGAP_BOND_MGR
When my iPhone device connects to the CC2650 I get the GAP Link Established Event (0x605) sent to my external MCU.
I then perform a paring and bonding.
When my iPhone device disconnects I do not get the GAP Link Terminated Event (0x606) sent to my external MCU.
Is this the correct HCI event to check for when a device breaks its Bluetooth connection with the CC2650?