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Part Numbers: CC2642R, CC2652R, CC1352R and CC1352P with integrated +20dBm PA
TI is pleased to announce pre-production availability of the CC1352R, CC1352P (with integrated +20dBm Power Amplifier option) and CC26x2R family of Bluetooth® low energy (BLE) wireless microcontrollers (MCUs) supporting Bluetooth 5 to the SimpleLink™ MCU portfolio. Starting today, customers can order a compatible LaunchPad development kit, download the CC13x2 or CC26x2 SimpleLink SDKs featuring the royalty-free Bluetooth 5 protocol stack (BLE5-Stack) and begin development of their wireless application for these next-generation BLE5 SoCs.
The CC13x2 and CC26x2 family of wireless MCUs contain a 32-bit ARM® Cortex®-M4F processor running at 48 MHz as the main application processor, 352 kB of in-system programmable flash memory, 256kB of device ROM, 80 kB of low-leakage SRAM, a full complement of peripherals such as ADC, I2C, SPI and UART, advanced cryptography accelerators (ECC, AES256, SHA256, etc.) as well as a Sensor Controller Engine (SCE). The SCE is a 2nd programmable processor core ideal for ultra-low power sensor acquisition and data processing applications. The SCE runs independently from the main Cortex-M4F and handles sensor polling using just a few micro amps of average current. A dedicated Radio Controller (ARM Cortex-M0) handles low-level RF and physical layer (PHY) protocol commands that are stored in ROM or RAM, thus ensuring ultra-low power and great flexibility. A comprehensive list of capabilities can be found in the device data sheet and Technical Reference Manual.
The following CC1352R, CC1352P and CC26x2R BLE wireless MCUs, SDKs & LaunchPad™ development kits (*) are supported:
CC26x2R LaunchPad (LAUNCHXL-CC26X2R1)
SimpleLink CC2642R Bluetooth low energy wireless MCU
SimpleLink CC2652R multi-standard wireless MCU
BLE5 and 802.15.4 (ZigBee®, Thread, TI 15.4) in 2.4GHz ISM
CC1352 LaunchPads (LAUNCHXL-CC1352R1,LAUNCHXL-CC1352P)
SimpleLink multi-band CC1352R and CC1352P wireless MCUs
BLE5 and Sub-1GHz, 'P' variants support integrated PA option
(*)Please note that these LaunchPad development kits are for early evaluation only and are built with pre-RTM silicon. Software compatibility after newer or updated silicon is released is not guaranteed. At this time, the development kit must be replaced with the new revision. A discount for the new revision of the LaunchPad will be available to customers who purchased the early evaluation version.
When will the CC13x2 and CC26x2 devices enter mass production?
We anticipate a production Release to Manufacturing (RTM) date of early 2019. To receive the latest product announcements please register for Wireless Connectivity updates in your myTI account.
How is the pre-release silicon different from the final production silicon?
All device features, including memory sizes, supported peripherals and device pin out on current pre-production silicon version PG1.1 are expected to remain the same on production silicon. This will allow a seamless migration for applications developed with the pre-release silicon that are deploying on production silicon. In addition to any improvements identified during normal silicon validation, the device ROM will be updated with the latest Bluetooth 5 protocol stack (BLE5-Stack) to maximize flash memory availability to the application. An updated SDK and a Bluetooth SIG qualification (QDID) for the protocol stack will also be offered to support the production silicon release.
Is Bluetooth 5 backwards compatible with earlier Bluetooth 4.0 / 4.1 / 4.2 LE devices?
Yes! BLE devices that implement Bluetooth 5 can safely interoperate with devices supporting earlier versions of the Bluetooth LE specification. To learn more about features available in Bluetooth 5 and TI’s BLE5-Stack, including Long Range connections with the LE Coded PHYs and Advertising Extensions (AE), see our Bluetooth® 5 Is Here: Top Five Questions Answered post on E2E.
Do the CC13x2 and CC26x2 devices consume more power as compared to CC13x0/CC26x0?
Our measurements show that total power consumption for typical BLE use cases remains on par with or slightly improved over first generation CC13xx/CC26xx wireless MCUs. One notable improvement is the total standby current consumption remains at around 1uA with the full 80kB of SRAM and CPU registers retained. The CC13x2 and CC26x2 have standby current consumption equivalent to CC26x0 devices despite the 4x increase in SRAM. For low duty cycle applications powered from coin cell batteries, this can, for example, make the difference of several years of additional battery life.
What do the 'R' and 'P' designators stand for?
Devices with the 'R' (e.g., CC2642R) have standard output power (up to +5 dBm in 2.4 GHz) while devices with 'P' feature an integrated +20 dBm power amplifier (PA). Note that radiated output power may vary due to RF layout and band-specific or regulatory limitations. Both 'R' and 'P' devices have the same MCU features and performance, i.e., size of memory, CPU speed, number of peripherals, standby power consumption, etc.
Are CC26x2 devices pin compatible with CC26x0 or CC2640R2F?
All CC26x2R devices (CC2642, CC2652) are pin-to-pin compatible with CC2640/CC2650 and CC2640R2F devices in the 7x7 QFN package size. Please note that a 48 MHz high-speed oscillator and different inductor sizes are required for designs incorporating CC26x2R devices. Refer to the HW Migration Guide application notes for details on moving from CC26x0 to CC26x2R.
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