CC2640R2F: Bonding fails

Hy,

here is the bt snoop log in two downloads, I do not know which one works within the TI forum:

/cfs-file/__key/communityserver-discussions-components-files/538/1348.btsnoop_5F00_hci.log

https://cloud.pieye.org/index.php/s/HFzZ5cLeY6NNX6G

A Samsung J5 (SamsungE_83:3c:af (LytentecJ5)  )wants to talk to the BLE device (  TexasIns_81:cf:37 (ZFOBD ))

Does that give you any insights?

Regards

Harald

Hy Tim,

yes, this might have become unclear in the meantime:

In the very end the overall system shall work like this:

During production every device gets a passcode. This passcode is printed on the label of the device and stored to the external flash. When the device is taken into operation and connected the first time the user scans the printed passcode with the Android/iOS App, then the app shall be able to connect and bond to the device. If for whatever reason reading the code by camera is not possible the user shall be able to enter the code manually.

Because at the beginning of the project pair/bond did not work instantly we decided to postpone the implementation that the developers of the app are able to connect and read and write data. I created a firmware version without pairing bonding which works perfectly for my PC connection (pygatt and BLED112), the iOS and _some_ android devices. On about 50% of the devices we are not able to connect because a bonding is initiated immediately which fails.

>remove the device from the paired devices in the phone's Bluetooth settings and erase the embedded device's flash before starting.

I did not find a way of removing the device from my bonded devices because I assume it is not bonded. In androids bluetooth list it appears under "available devices" and not under "bonded devices". I also switched off and on Bluetooth and reboot the android device.

As for the BLE peripheral device: I used "mass erase" in Flash Programmer Tool and flashed BIM, Stack and App from flash programmers tool. I did not delete external flash but I can't think of how this can influence the behaviour.

> Also, please describe how to replicate this in a step by step process

- open nRF Connect on Android Samsung J5

- scan for devices

- identify UUT and verify advertising and scan response data -> everything OK

- press connect on UUT

- Android vibrates, no mask appears

- message "unable to communicate"

- Device is still connected, everything works: Discover, read, notify

- Press "bond" on android

- Android vibrates, no mask appears

- device disconnects

https://youtu.be/yMcQJ4Xg8Y0

When using the original simple peripheral off chip example it feels like expected:

- connect

- press bond

- mask appears, enter passcode

- android shows "bonded"

Again: I don't observe anything on the BLE peripheral device, no breakpoint is reached. What code should be called initially when a android device tries to bond? What ways of analyzing do I have? What settings do I need to check?

Regards

Harald

Hy Tim,

thanks for your message.

>1. Compare the GAPBondMgr parameters that you are using between your project and the default simple_peripheral project. I w

I have done that before. My settings are identical

>I see that you have removed the pairing state callback.

I have not, there is no pairing state callback in the sample application.

>So you should verify that you are actually getting to your process passcode / pair state function in your application.

No, I do not. I do not reach any breakpoint that I set anywhere in the callback function.

I started to do it the hard way:

I started the project from scratch, so I used simple_peripheral_oad_offchip and integrated all code of my project step by step.

After every integration of a couple of source code lines I tested if bonding works OK.

Now I am at the point where a simple change in the source code gets my project into the false state:

Within the init function I call my own init function:

static void simplePeripheral_init(void)
{
  // ******************************************************************
  // NO STACK API CALLS CAN OCCUR BEFORE THIS CALL TO ICall_registerApp
  // ******************************************************************
  // Register the current thread as an ICall dispatcher application
  // so that the application can send and receive messages.
  ICall_registerApp(&selfEntity, &syncEvent);
  ...
  uint8_t status = osal_snv_read(BLE_NVID_CUST_START,
                                  sizeof(sendSvcChngdOnNextBoot),
                                  (uint8 *)&sendSvcChngdOnNextBoot);
  if(status != SUCCESS)
  {
    /*
     * On first boot the NV item will not have yet been initialzed, and the read
     * will fail. Do a write to set the initial value of the flash in NV
     */
     osal_snv_write(BLE_NVID_CUST_START, sizeof(sendSvcChngdOnNextBoot),
                    (uint8 *)&sendSvcChngdOnNextBoot);
  }
#endif // ( defined(GAP_BOND_MGR) && !defined(GATT_NO_SERVICE_CHANGED) )
  initApplication();

}
void initApplication(void)
{
    PWM_Params      pwmParams;

    /* Call driver init functions. */
    PWM_init();
    PWM_Params_init(&pwmParams);
    pwmParams.dutyUnits = PWM_DUTY_FRACTION;
    pwmParams.dutyValue = PWM_DUTY_FRACTION_MAX / 2;
    pwmParams.periodUnits = PWM_PERIOD_HZ;
    pwmParams.periodValue = 1000;
    pwmParams.idleLevel = PWM_IDLE_LOW;
    canclkpwm = PWM_open(Board_5XD_PWM0, &pwmParams);
    if ((uint32_t)canclkpwm == 0) {
        /* Board_PWM0 did not open */
        while (1);
    }

    PWM_start(canclkpwm);

/* Open SPI as master (default) */
    SPI_Params_init(&spiParams);
    spiParams.bitRate = 8000000;  // 8 MHz Bit rate
    spiParams.frameFormat = SPI_POL0_PHA0;
    spiParams.transferTimeout = 0x1000;
    SPI_init();
    masterSpi = SPI_open(Board_5XD_SPI0, &spiParams);

    GPIO_write(Board_SPI_FLASH_CS, 1);
    GPIO_write(Board_SPI_CANA_CS, 1);
    GPIO_write(Board_SPI_CANB_CS, 1);
}

When I comment out the call to initApplication(); within simplePeripheral_init function bonding works OK, when I execute the initApplication(); function bonding does not work. The initApplication function itself works fine, the PWM signal is as expected and I can use SPI.

Something must get corrupt when calling this function. Any idea on where to search?

Might that be a memory issue? I do not get any warnings and the map files seem OK:

App:
MEMORY CONFIGURATION

         name            origin    length      used     unused   attr    fill
----------------------  --------  ---------  --------  --------  ----  --------
  FLASH_IMG_HDR         00000000   000000a8  00000050  00000058  R  X
  ENTRY                 000000a8   00000040  0000003c  00000004  R  X
  FLASH                 000000e8   00013f98  00009b02  0000a496  R  X
  SRAM                  20000000   00003f68  00002865  00001703  RW X

Stack:
MEMORY CONFIGURATION

         name            origin    length      used     unused   attr    fill
----------------------  --------  ---------  --------  --------  ----  --------
  FLASH                 00000000   0001e000  0000a000  00014000  R  X
  SRAM                  20000000   00004400  00000498  00003f68  RW X


SEGMENT ALLOCATION MAP

run origin  load origin   length   init length attrs members
----------  ----------- ---------- ----------- ----- -------
00014000    00014000    00008edc   00008edc    r-x
  00014000    00014000    00000050   00000050    r-- .image_header
  00014050    00014050    00007858   00007858    r-x .text
  0001b8a8    0001b8a8    00000e30   00000e30    r-- .const
  0001c6d8    0001c6d8    00000094   00000094    r-- .rodata
  0001c770    0001c770    000003e0   000003e0    r-- .cinit
  0001cb50    0001cb50    0000038c   0000038c    r-x EntrySection
0001d000    0001d000    00001000   00001000    r--
  0001d000    0001d000    00001000   00001000    r-- .snvSectors
20003f68    20003f68    00000498   00000000    rw-
  20003f68    20003f68    000003b0   00000000    rw- .data
  20004318    20004318    000000e8   00000000    rw- .bss

BIM:
MEMORY CONFIGURATION

         name            origin    length      used     unused   attr    fill
----------------------  --------  ---------  --------  --------  ----  --------
  FLASH_BIM             0001e000   00001f54  0000115f  00000df5  R  X
  FLASH_CERT            0001ff54   0000004c  00000000  0000004c  R  X
  FLASH_FNPTR           0001ffa0   00000004  00000000  00000004  R  X
  FLASH_CCFG            0001ffa8   00000058  00000058  00000000  R  X
  SRAM                  20000000   00004400  0000437c  00000084  RW X

Regards

Harald