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BOOSTXL-CC2650MA: Pairing/Bonding example for using in SAP mode?

Part Number: BOOSTXL-CC2650MA

Is there an example for bonding/pairing in BLE using the MODA as a SNP/SAP (A la C:\ti\simplelink_sdk_ble_plugin_3_20_00_24\examples\rtos\MSP_EXP432P401R\bluetooth\simple_application_processor)?

I think I see most of it, but I don't know how to set the GAP Bond Manager via the SNP commands...

Ideally, I want It Just Works paring/bonding on request from a phone app (so when the phone sees the BLE device, it will connect).  I'm trying to implement the BLE-MIDI stack and I think it's not showing up in the app because I don't have bonding working.